Design Services
We have extensive MEMS design and CAD capabilities including AutoCAD design
of MEMS devices, photomask sets, and shadow mask sets. We also have expertise
in the design of specialized substrate carriers, holders, fixtures, and
accessories for use during semiconductor processing.
Lithography Services
We can perform NUV contact and near-proximity lithography
on 4-inch and 6-inch wafers as well as substrates of various
other shapes and sizes, with features as small as 1 micron. We
have considerable experience with thick resist processes as well
as the fabrication of shadow masks.
Magnetron Sputtering
Our multi-target sputtering system can deposit most
metals, insulators and compound materials including in part:
Aluminum, Copper, Gold, Titanium. Pulsed DC sputtering allows
us to offer services for most oxides and nitrides. In-situ multi-target
capability allows for the deposition of multilayers without breaking
vacuum. 6” sputtering targets and rotating substrate holders
maximize thin film uniformity.
Xenon difluoride etching
Our Xetch xenon difluoride etching system allows for
the isotropic dry vacuum etching of silicon layers, including
release layers, on substrates as large as 6” diameter,
without the drawbacks associated with wet chemistry.
Wet etching
Verimetra's wet processing facilities include acid and solvent benches
suitable for virtually any type of chemical cleaning or etching, including
RCA cleans and the etching of oxides, nitrides, silicon and other semiconductors,
and metals.
